SP6661

200mA Charge Pump Inverter, Doubler
Data Sheets OBS (Obsolete)

Overview

Information
# of Outputs
IOUT (A) 0.2
Peak Switch Current (A)
VIN MIN (V) 1.5
VIN MAX (V) 5.3
Startup Voltage (V) n/a
IQ (µA) 3000
VOUT MIN (V) -5
VOUT MAX (V) 10
Frequency (kHz) 120/900
Efficiency (%) 94
Operating Temperature (°C) -40 to 85
Package SOIC-8, MSOP-8
Special Features Charge pump topology, Selectable oscillator, External oscillator Input
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The SP6660 is a CMOS DC/DC monolithic voltage converter that can be implemented as a voltage inverter or a positive voltage doubler. As a voltage inverter, a -1.5V to -4.25V output can be converted from a +1.5V to +4.25V input. As a voltage doubler, the SP6660 can provide a +8.0V output at 100mA from a +4.25V input. The SP6660 is ideal for both battery powered and board level voltage conversion applications with a typical operating current of 400μA and a high efficiency (>90%) over most of its load current range. Typical end products for this device are operational amplifier and interface power supplies, medical instruments, and handheld and laptop computers. The SP6660 is available in 8-pin DIP, SOIC and μSOIC packages.

  • Inverts or doubles input supply voltage
  • 92% power efficiency at 100mA
  • 120kHz/900kHz selectable oscillator frequency
  • 4.5Ω output resistance using 3.3µF ceramic caps
  • Low voltage battery operation
  • Ideal for 3.6V lithium ion battery or 5.0V input
  • High output current – 200mA
  • Low profile solution
  • 1.5V inverter start-up guaranteed

Documentation & Design Tools

All Types Data Sheets Application Notes Product Briefs & Brochures Symbols & Footprints User Guides & Manuals
Type Title Version Date File Size
Data Sheets SP6661 High Frequency 200mA Charge Pump Inverter or Doubler 1.0.0 December 2005 513.4 KB
Application Notes AN200, Downloading and Installing CAD Symbols and Footprints with Ultra Librarian April 2019 1.2 MB
Application Notes ANI-01, 1.8V RS232 Interface Using SP3203E & SP6661 B November 2006 31.4 KB
User Guides & Manuals SP6661 Evaluation Board Manual 1.0.0 April 2001 51.2 KB
Product Brochures Power Management Brochure R01 November 2024 2.4 MB
Symbols & Footprints SP6661EN-L CAD File (.bxl) September 2018 75.9 KB
Symbols & Footprints SP6661EN-L/TR CAD File (.bxl) September 2018 75.5 KB
Symbols & Footprints SP6661EU-L/TR CAD File (.bxl) September 2018 79.6 KB
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Quality & RoHS

Part Number RoHS | Exempt RoHS Halogen Free REACH TSCA MSL Rating / Peak Reflow Package
SP6661EN-L N Y Y Y Y L1 / 260ᵒC NSOIC8
SP6661EN-L/TR N Y Y Y Y L1 / 260ᵒC NSOIC8
SP6661EU-L/TR N Y Y Y Y L1 / 260ᵒC MSOP8

Click on the links above to download the Certificate of Non-Use of Hazardous Substances.

Additional Quality Documentation may be available, please Contact Support.

Parts & Purchasing

Part Number Pkg Code Min Temp Max Temp Status Suggested Replacement PDN
SP6661CN NSOIC8 0 70 OBS
SP6661CN-L NSOIC8 0 70 OBS
SP6661CN-L/TR NSOIC8 0 70 OBS
SP6661CN/TR NSOIC8 0 70 OBS
SP6661CP PDIP8 0 70 OBS
SP6661CU MSOP8 0 70 OBS
SP6661CU-L MSOP8 0 70 OBS
SP6661CU-L/TR MSOP8 0 70 OBS
SP6661CU/TR MSOP8 0 70 OBS
SP6661EN NSOIC8 -40 85 OBS
SP6661EN-L NSOIC8 -40 85 OBS
SP6661EN-L/TR NSOIC8 -40 85 OBS
SP6661EN/TR NSOIC8 -40 85 OBS
SP6661EP PDIP8 -40 85 OBS
SP6661EU MSOP8 -40 85 OBS
SP6661EU-L MSOP8 -40 85 OBS
SP6661EU-L/TR MSOP8 -40 85 OBS
SP6661EU/TR MSOP8 -40 85 OBS
SP6661EB Board 0 85 OBS
SP6661UEB Board 0 85 OBS
Show obsolete parts
Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.

Packaging

Pkg Code Details Quantities Dimensions
NSOIC8
  • JEDEC Reference: MS-012
  • MSL Pb-Free: L1 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 128.4ºC/W (std); 96.8ºC/W (fused)
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: 98
  • Quantity per Reel: 2500
  • Quantity per Tube: 98
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 12 x 8
  • Tape & Reel Unit Orientation: Quadrant 1
  • Dimensions: mm
  • Length: 4.90
  • Width: 3.90
  • Thickness: 1.75
  • Lead Pitch: 1.27
PDIP8
  • JEDEC Reference: MS-001
  • MSL Pb-Free: n/a
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 84.6ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: 50
  • Quantity per Reel: n/a
  • Quantity per Tube: 50
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): n/a
  • Tape & Reel Unit Orientation: n/a
  • Dimensions: inch
  • Length: 0.365
  • Width: 0.250
  • Thickness: 0.130
  • Lead Pitch: 0.100
MSOP8
  • JEDEC Reference: MO-187
  • MSL Pb-Free: L1 @ 260°C
  • MSL SnPb Eutectic:
  • ThetaJA: 163
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: 50
  • Quantity per Reel: 2500
  • Quantity per Tube: 50
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330x12x8
  • Tape & Reel Unit Orientation: Quadrant 1
  • Dimensions: mm
  • Length: 3
  • Width: 3
  • Thickness: 0.85
  • Lead Pitch: 0.65

Notifications

Distribution Date Description File
02/01/2023 Product Discontinuation Notice
07/11/2017 Product Discontinuation Notification
02/23/2017 Qualification of alternate assembly subcon, ANST, China.
04/13/2016 Qualification of alternate assembly subcon, JCET.
07/02/2013 Qualification of an alternate qualified assembly supplier, ASE Chung-Li (Taiwan) for the 8L NSOIC package using copper wire bonding. Material change and alternate assembly supplier qualified.
08/29/2011 Material change: Mold compound and die attach material are changed and the listed parts will be fully Green (halogen-free). Migrating to green environment and material standardization.
03/23/2010 Alternate qualified assembly supplier Capacity enhancement
12/07/2009 Enhancement of NSOIC 8, NSOIC14 and NSOIC16 packages to Green (halogen-free) via Mold Compound & Die Attach Material. Enhance packages to be Green (halogen-free).
09/10/2008 Notice of Obsolescence –Selected Power Management Parts This is notification that the Power Management products listed on the attached page have been discontinued by Exar Corporation due to low market demand, effective immediately.
02/28/2007 Product Obsolescence Letter and Discontinuation Notification. Discontinued.

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