SP3243EB

Intelligent +3.0V to +5.5V RS-232 Transceiver
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Overview

Information Intelligent +3.0V to +5.5V RS-232 Transceiver
Supply Voltage (Nom) (V) 3.3, 5
No. of Tx 3
No. of Rx 5
Data Rate (kbps) 250
HBM ESD (kV) 15
IEC 61000-4-2 Contact (±kV) 8
Int. Charge Pump
No. of Ext Caps 4
Nom Cap Value (µF) 0.1
Shutdown
Internal Caps
TTL Tri-State
Auto On-Line
VL Pin
Temperature Range (°C) 0 to 70, -40 to 85
Package SSOP-28, TSSOP-28
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The SP3243E products are 3 driver/5 receiver RS-232 transceiver solutions intended for portable or hand-held applications such as notebook and palmtop computers. The SP3243E includes one complementary receiver that remains alert to monitor an external device's Ring Indicate signal while the device is shutdown. The SP3243E and EB devices feature slew-rate limited outputs for reduced crosstalk and EMI. The "U" and "H" series are optimized for high speed with data rates up to 1Mbps, easily meeting the demands of high speed RS-232 applications. The SP3243E series uses an internal high-efficiency, charge-pump power supply that requires only 0.1μF capacitors in 3.3V operation. This charge pump and MaxLinear's driver architecture allow the SP3243E series to deliver compliant RS-232 performance from a single power supply ranging from +3.0V to +5.5V. The AUTO ON-LINE® feature allows the device to automatically "wake-up" during a shutdown state when an RS-232 cable is connected and a connected peripheral is turned on. Otherwise, the device automatically shuts itself down drawing less than 1μA.

  • Meets true EIA/TIA-232-F Standards from a +3.0V to +5.5V power supply
  • ±15kV ESD protection
  • Interoperable with EIA/TIA-232 and adheres to EIA/TIA-562 down to a +2.7V power source
  • AUTO ON-LINE® circuitry automatically wakes up from a 1µA shutdown
  • Regulated Charge Pump Yields Stable RS-232 Outputs Regardless of VCC Variations
  • Enhanced ESD Specifications:
    • ±15kV Human Body Model
    • ±15kV IEC1000-4-2 Air Discharge
    • ±8kV IEC1000-4-2 Contact Discharge
  • 250 Kbps min. transmission rate (EB)
  • 1000 Kbps min. transmission rate (EU)
  • Ideal for High Speed RS-232 Applications

Documentation & Design Tools

Type Title Version Date File Size
Data Sheets SP3243E 3 Driver / 5 Receiver Intelligent +3.0V to +5.5V RS-232 Transceivers 1.0.5 June 2022 416.4 KB
Application Notes RS-232 and RS-485 PCB Layout Application Note R00 December 2022 2.8 MB
Application Notes ANI-10, Charge Pump Capacitor Selection Guide for 3V RS-232 Products B December 2006 71.8 KB
Application Notes ANI-15, Upgrade from the 3241 to SP3243E B December 2006 51.8 KB
Product Brochures Interface Brochure R01 June 2024 3.6 MB
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Quality & RoHS

Part Number RoHS | Exempt RoHS Halogen Free REACH TSCA MSL Rating / Peak Reflow Package
SP3243EBCA-L/TR N Y Y Y Y L2 / 260ᵒC SSOP28
SP3243EBEA-L/TR N Y Y Y Y L2 / 260ᵒC SSOP28
SP3243EBCY-L/TR N Y Y Y Y L1 / 260ᵒC TSSOP28
SP3243EBEY-L N Y Y Y Y L1 / 260ᵒC TSSOP28
SP3243EBEY-L/TR N Y Y Y Y L1 / 260ᵒC TSSOP28

Click on the links above to download the Certificate of Non-Use of Hazardous Substances.

Additional Quality Documentation may be available, please Contact Support.

Parts & Purchasing

Part Number Pkg Code Min Temp Max Temp Status Suggested Replacement Buy Now Order Samples PDN
SP3243EBCA SSOP28 0 70 OBS
SP3243EBCA-L SSOP28 0 70 OBS SP3243EBCA-L/TR
SP3243EBCA-L/TR SSOP28 0 70 Active Order
SP3243EBCA/TR SSOP28 0 70 OBS
SP3243EBCR QFN32 5x5 OPT1 0 70 OBS
SP3243EBCR-L QFN32 5x5 OPT1 0 70 OBS SP3243EBCR-L/TR
SP3243EBCR-L/TR QFN32 5x5 OPT1 0 70 OBS SP3243EBCA-L/TR
SP3243EBCR/TR QFN32 5x5 OPT1 0 70 OBS
SP3243EBCT WSOIC28 0 70 OBS
SP3243EBCT-L WSOIC28 0 70 OBS SP3243EHCT-L
SP3243EBCT-L/TR WSOIC28 0 70 OBS SP3243EHCT-L/TR
SP3243EBCT/TR WSOIC28 0 70 OBS
SP3243EBCY TSSOP28 0 70 OBS
SP3243EBCY-L TSSOP28 0 70 OBS SP3243EBCY-L/TR
SP3243EBCY-L/TR TSSOP28 0 70 Active Order
SP3243EBCY/TR TSSOP28 0 70 OBS
SP3243EBEA SSOP28 -40 85 OBS
SP3243EBEA-L SSOP28 -40 85 OBS SP3243EBEA-L/TR
SP3243EBEA-L/TR SSOP28 -40 85 Active Order
SP3243EBEA/TR SSOP28 -40 85 OBS
SP3243EBER-L QFN32 5x5 OPT1 -40 85 OBS SP3243EUER-L
SP3243EBER-L/TR QFN32 5x5 OPT1 -40 85 OBS SP3243EUER-L/TR
SP3243EBET WSOIC28 -40 85 OBS
SP3243EBET-L WSOIC28 -40 85 OBS SP3243EUET-L
SP3243EBET-L/TR WSOIC28 -40 85 OBS SP3243EUET-L/TR
SP3243EBET/TR WSOIC28 -40 85 OBS
SP3243EBEY TSSOP28 -40 85 OBS
SP3243EBEY-L TSSOP28 -40 85 Active Order
SP3243EBEY-L/TR TSSOP28 -40 85 Active Order
SP3243EBEY/TR TSSOP28 -40 85 OBS
Show obsolete parts
Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.

Packaging

Pkg Code Details Quantities Dimensions
QFN32 5x5 OPT1
  • JEDEC Reference: MO-220
  • MSL Pb-Free: L2 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 30ºC/W
  • Bulk Pack Style: Canister
  • Quantity per Bulk Pack: 490
  • Quantity per Reel: 3000
  • Quantity per Tube: n/a
  • Quantity per Tray: 490
  • Reel Size (Dia. x Width x Pitch): 330 x 12 x 8
  • Tape & Reel Unit Orientation: Quadrant 1
  • Dimensions: mm
  • Length: 5.00
  • Width: 5.00
  • Thickness: 1.00
  • Lead Pitch: 0.50
SSOP28
  • JEDEC Reference: MO-150
  • MSL Pb-Free: L2 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 67.1ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: 46
  • Quantity per Reel: 1500
  • Quantity per Tube: 46
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 24 x 12
  • Tape & Reel Unit Orientation: Quadrant 1
  • Dimensions: mm
  • Length: 10.20
  • Width: 5.30
  • Thickness: 2.00
  • Lead Pitch: 0.65
TSSOP28
  • JEDEC Reference: MO-153
  • MSL Pb-Free: L1 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 76ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: 50
  • Quantity per Reel: 2500
  • Quantity per Tube: 50
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 16 x 8
  • Tape & Reel Unit Orientation: Quadrant 1
  • Dimensions: mm
  • Length: 9.70
  • Width: 4.40
  • Thickness: 1.2
  • Lead Pitch: 0.65
WSOIC28
  • JEDEC Reference: MS-013
  • MSL Pb-Free: L3 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 58.6ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: 27
  • Quantity per Reel: 1500
  • Quantity per Tube: 27
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 24 x 12
  • Tape & Reel Unit Orientation: Quadrant 1
  • Dimensions: mm
  • Length: 17.90
  • Width: 7.50
  • Thickness: 2.65
  • Lead Pitch: 1.27

Notifications

Distribution Date Description File
07/17/2023 In 2023, MaxLinear will be converting all shipping labels for the parts noted from an EXAR format to MaxLinear’s label. During this transition customers may receive either label. This change affects only shipping and packing labels. This change will not affect the part number, part marking, manufacturing process or manufacturing sites. Only work in progress material will be converted. Existing inventory from MaxLinear’s warehouse, channel sales, distributor, and such, will not be converted. Hence, customers may experience receiving mixed shipments with both Exar and MaxLinear labels for some period until existing inventory of old labels is eventually cleared out. Situation is product to product with no predictable way to determine when all old labels will be exhausted. No change to product form, fit, function and reliability. ADDENDUM A: Fixed MBB label logo for DX204001 to MaxLinear logo. ADDENDUM B: Replaced ‘All other affected products outer box label’ with clearer pictures. Corrected Date Issued (from original PCN) issue date +90 days to August 30, 2023.
06/01/2023 In 2023, MaxLinear will be converting all shipping labels for the parts noted from an EXAR format to MaxLinear’s label. During this transition customers may receive either label. This change affects only shipping and packing labels. This change will not affect the part number, part marking, manufacturing process or manufacturing sites. Only work in progress material will be converted. Existing inventory from MaxLinear’s warehouse, channel sales, distributor, and such, will not be converted. Hence, customers may experience receiving mixed shipments with both Exar and MaxLinear labels for some period until existing inventory of old labels is eventually cleared out. Situation is product to product with no predictable way to determine when all old labels will be exhausted. No change to product form, fit, function and reliability.
06/01/2023 In 2023, MaxLinear will be converting all shipping labels for the parts noted from an EXAR format to MaxLinear’s label. During this transition customers may receive either label. This change affects only shipping and packing labels. This change will not affect the part number, part marking, manufacturing process or manufacturing sites. Only work in progress material will be converted. Existing inventory from MaxLinear’s warehouse, channel sales, distributor, and such, will not be converted. Hence, customers may experience receiving mixed shipments with both Exar and MaxLinear labels for some period until existing inventory of old labels is eventually cleared out. Situation is product to product with no predictable way to determine when all old labels will be exhausted. No change to product form, fit, function and reliability. ADDENDUM: Fixed MBB label logo for DX204001 to MaxLinear logo.
04/11/2022 MaxLinear has qualified Key Foundry wafer foundry in order to increase production capacity and to facilitate long term support of the product line. The wafer process is 0.18um BCD. There is no change to form, fit, function and the products meet existing datasheet specifications. In addition to the currently qualified ANST site, Greatek is added as an alternate site for package, assembly, and test. There are no changes in device reliability. (See PCN for details)
04/11/2022 MaxLinear has qualified Key Foundry wafer foundry in order to increase production capacity and to facilitate long term support of the product line. The wafer process is 0.18um BCD. There is no change to form, fit, function and the products meet existing datasheet specifications. In addition to the currently qualified ANST site, Greatek is added as an alternate site for package, assembly, and test. There are no changes in device reliability. (See PCN for details)
02/05/2018 Add additional option for SSOP 28 packing: 16mm width size of tape & reel.
07/11/2017 Product Discontinuation Notification
07/10/2017 Material Change. JCET qualification to use Tongling Poongsan Sanjia lead frame and HITACHI CEL-9240 mold compound for SSOP 28L package.
05/10/2017 Qualification of alternate assembly subcon, JCET.
01/05/2017 Addition of an alternate qualified location, ANST, China.
12/19/2016 Qualification of alternate assembly subcon, ANST, China.
08/11/2016 Qualification of alternate assembly subcon, JCET.
07/26/2016 Product discontinuation notification. Discontinued.
01/12/2015 Alternate Foundry and Assembly Site. Qualification of TSMC (using 0.25um CMOS process), and Greatek Taiwan (using either copper or gold wire-bond).
07/26/2013 5-inch wafer with PSG 10KÅ passivation Material and other (foundry 6 inch wafer qualification) changes.
07/02/2013 Qualified copper wire bonding assembly in addition to currently qualified gold wire bonding assembly in Carsem. Material change.
02/07/2012 Material Change: Bond wire changed from gold to copper. To prevent a cost increase of product to customers due to the rising prices of gold.
05/10/2011 Product Discontinuation Notice. Discontinued due to low market demand.
07/15/2010 Change in packing quantity per reel and also carrier tape width/pitch. Standardization
02/28/2007 Product Obsolescence Letter and Discontinuation Notification. Discontinued.
05/08/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
02/02/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site

FAQs & Support

Search our list of FAQs for answers to common technical questions.
For material content, environmental, quality and reliability questions review the Quality tab or visit our Quality page.
For ordering information and general customer service visit our Contact Us page.

Submit a Technical Support Question As a New Question

For RS-232 it is 50 feet (15 meters), or the cable length equal to a capacitance of 2500 pF, at a maximum transmission rate of 19.2kbps. When we reduce the baud rate, it allows for longer cable length. For Example:

 

Baud Rate (bps)

Maximum RS-232 Cable Length (ft)

19200

50

9600

500

4800

1000

2400

3000

 
For RS-485 / RS-422 the data rate can exceed 10Mbps depending on the cable length. A cable length of 15 meters (50 feet) will do a maximum of 10Mbps. A cable length of 1200 meters (4000 feet) will do a maximum of 90kbps over 24 AWG gauge twisted pair cable (with 10 pF/ft). Refer to Annex A TIA/EIA-422-B. Also refer the RS-485 Cable Lengths vs. Data Signaling Rate Application Note (AN-292).
 
 

RS-232 uses both positive and negative voltages for signaling. The RS-232 driver needs a charge pump circuit to generate these signal voltages from a single Vcc supply. Four capacitors are needed to generate the positive (V+ or Vdd) and negative (V- or Vss) voltages.

ESD tests are “destructive tests.” The part is tested until it suffers damage. Therefore parts cannot be 100% tested in production, instead a sample of parts are characterized during the product qualification. The test procedure consists of “zapping” pins with a given voltage using the appropriate model and then running the part through electrical tests to check for functionality or performance degradation.

RS232 is the most widely implemented serial interface in the world. It is commonly installed as the serial port (9 pin or 25 pin) on PCs and has become ubiquitous on literally thousands of other applications. See below for comparisons.
 
Even though RS232 is a very old standard (first standardized in 1962) it is still popular because it is:
- simple, no software stack required, can be used to bring-up microcontrollers or load firmware on a “bare” system
- inexpensive, standard products exist from multiple vendors
- widely understood, support is already built in to most microcontrollers, the basics of serial communication are in most of the textbooks
- performance is adequate for many applications, simple data transfer, text or console ports, diagnostics, peripheral connectivity, etc.
 
However RS232 does have some limitations:
- It is slow by modern standards. Typical data rates are 1200 baud, 9600 baud, 115.2kbaud. High data rate RS232 devices are available up to 1Mbps. Faster speeds are uncommon.
- Signals swing to both positive and negative voltage. This requires an onboard charge pump to generate signals from a single power-supply chip or else multiple positive and negative supply rails.
- High pin-count per function. All signals are unidirectional and the charge pump requires several pins and external capacitors. So small footprint is difficult to achieve. Cables and connectors use more pins and wires than most modern serial protocols.
- Point-to-point only. Signals go from one driver to one receiver. RS232 does not support bi-directional signals or multiple drivers or receivers.
- Limited distance. RS232 uses single-ended signals which makes it difficult to support long cables. Typical RS232 cables are only about 10 meter or less. High speed (1Mbps) are typically less than 1 meter. The wide driver signal swing makes crosstalk a problem. Unbalanced signals with a shared ground reference are less able to withstand ground shifts between driver and receiver.
- Comparatively high power consumption. The wide signal swing takes quite a bit of power. By the RS232, signals idle at mark-state and receivers have typical 5kΩ impedance to ground, therefore drivers are constantly sourcing current even while idle. Many later RS232 transceivers’ feature shutdown modes or automatic power saving features (such as Auto On-Line, Auto On-Line Plus, Intelligent charge pumps, etc.). However some of the most commoditized devices lack any shutdown function.
 
RS485 overcomes most of the limitations of RS232 and is an excellent complement to RS232.
- RS485 uses differential signaling and is capable of much higher data rates (up to 20Mbit/sec)
- Differential signals also allow RS485 to communicate over 1200 meter cable lengths. Longer runs are possible with some careful system optimization.
- Bi-directional and multi-drop operation. RS485 can be used to build multidrop networks with many transmitters and many receivers.
- Balanced differential signalling also makes RS485 highly immune to noise. On twisted-pair cables a noise signal will couple equally to both wires in the pair and be ignored by the differential receiver.
 
RS485 is found mainly in industrial, telecom and commercial applications and is not as widespread in the consumer
or PC world. Therefore it is not seen as often as RS232.
 
Also the RS485 protocol standard defines only the electrical characteristics of the interface. The physical and logical implementations are left up to the user. Different connectors, different methods for bus-arbitration and data framing all exist under a wide variety of implementations. RS485 has also been used as the foundation for many proprietary or semi-proprietary standards. Therefore interoperability between RS485 based interfaces is not always as simple as with RS232.

ESD is caused by static electricity. In order for an ESD event to occur there must be a buildup of static charge. Very high charge levels are actually quite rare. In a normal factory environment, taking basic ESD precautions (grounding-straps, anti-static smocks, ionizers, humidity control, etc.) static levels can be kept below a few tens of volts. In an uncontrolled environment, like an office, static levels rarely get above 2000 volts. Under some worstcase conditions (wearing synthetic fabrics, rubbing against synthetic upholstered furniture, extremely low humidity)
levels can go as high as 12 to 15 thousand volts. Actually to get to 15000 volts or higher you would need to be in an uncomfortably dry environment (humidity below 10%) otherwise static charge will naturally dissipate through corona discharge. It would definitely be considered a “bad hair day.” Humans can generally feel a static shock only above 3000 volts. A discharge greater than 4000 volts can cause an audible “pop.” But repeated lower level discharges can be imperceptible and still may have a cumulative damaging effect on sensitive ICs. All ICs, even those with robust protection, can be damaged if they are hit hard enough or often enough.

Most ICs in a typical system are at greatest risk of ESD damage in the factory when the PCB is assembled and the system is being built. After the system is put together they are soldered onto the PCB and shielded within a metal or plastic system enclosure. Interface ICs are designed to attach to an external connector that could be exposed to ESD when a cable is plugged in or when a person or object touches the connector. These interface pins are most likely to see ESD exposure and therefore benefit from additional protection.

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