XR22802

Hi-Speed USB to 10/100 Ethernet Bridge w/2-CH UARTs
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Overview

Information Hi-Speed USB to 10/100 Ethernet Bridge w/2-CH UARTs
CPU Interface USB 2.0
Ethernet MAC/PHY (Mbps) 10/100
UART CH 2
Max Data Rate (Mbps) 15
UART Tx/Rx FIFO (Bytes) 1024/1024
Auto Half-Duplex Control ✔
No. of GPIOs 32
I2C Master ✔
HBM ESD (USB) (kV) ±15kV HBM
Supply Voltage Range VCC (V) 4.4 to 5.25
Max UART/GPIO Input Voltage (V) 3.6
Max UART/GPIO Output Voltage (V) 3.6
Temperature Range (°C) -40 to 85
Package QFN-56
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The XR22802 is a Hi-Speed USB 2.0 compound device with an embedded hub and 5 downstream USB functions: 10/100 Ethernet MAC and PHY, 2 UARTs, multi-master capable I2C controller, and an Enhanced DedicatedGPIO Entity (EDGE) controller.

The upstream USB interface has an integrated USB 2.0 PHY and device controller that is compliant with both Hi-Speed (480Mbps) and Full-Speed (12Mbps) USB 2.0. The vendor ID, product ID, power mode, remotewakeup support and maximum power consumption are amongst the values that can be programmed using the on-chip One-Time Programmable (OTP) memory.

The Ethernet controller has an integrated 10/100 Ethernet MAC and PHY and is compliant with IEEE 802.3. The Ethernet controller supports autonegotiation, auto-MDIX, checksum offload, auto-polarity correction in 10Base-T and remote wakeup capabilities.

The enhanced UART has a maximum data rate of 15 Mbps. Using a fractional baud rate generator, any baud rate between 300 bps and 15 Mbps can be accurately generated. In addition, the UART has a large 1024-byte TX FIFO and RX FIFO to optimize the overall data throughput for various applications. The automatic RS485 control feature simplifies both the hardware and software for half-duplex RS-485 applications. If required, the multidrop (9-bit) mode feature further simplifies typical multidrop applications by enabling / disabling the UART receiver depending on the address byte received.

The multi-master capable I2C controller and EDGE controller (up to 32 GPIOs) can be accessed via the USB HID interface. The EDGE pins or I2C interface can be used for controlling and monitoring other peripherals. Up to 2 EDGE pins can be configured as a PWM generator.


  • USB 2.0 Compliant Interface
  • 10/100 Ethernet MAC and Phy
  • Enhanced UART
  • Half-Duplex Mode
  • I2C Multi-master
  • Enhanced Dedicated GPIO Entity (EDGE)
  • Single +5.0V Power Supply Input
  • Regulated +3.3V Output Power
  • Single 25MHz Crystal
  • ±15kV HBM ESD Protection on USB data pins
  • ±8kV HBM ESD Protection on all other pins

  • USB to Ethernet Dongles
  • POS Terminals
  • Test Instrumentation
  • Networking
  • Factory Automation and Process Controls
  • Industrial Applications

Download Software Drivers

Documentation & Design Tools

All Types Data Sheets Application Notes Schematics & Design Files Product Briefs & Brochures Software & Utilities User Guides & Manuals
Type Title Version Date File Size
Data Sheets XR22802 Hi-Speed USB to 10/100 Ethernet Bridge 1D April 2019 1 MB
Application Notes AN202, USB UART Board Design Considerations for USB Compliance R02 June 2023 2.4 MB
Application Notes AN-226, Windows Driver Customization for USB UARTs R00 February 2020 2.5 MB
User Guides & Manuals XR2280x USB Ethernet Bridges Design Guide 00 April 2020 2.3 MB
User Guides & Manuals XR22804 Evaluation Board User’s Manual 1A May 2016 1.4 MB
Software: GUIs & Utilities Sample USB UART GUI (Serial Test App) 1.2.0.0 July 2021 1.4 MB
Software: GUIs & Utilities Android Application 1C November 2015 476.6 KB
Errata XR2280x Errata R01 July 2022 2.3 MB
Product Flyers Full-Speed USB UART Family 1.1 November 2020 605.3 KB
Schematics & Design Files XR22802/804 Evaluation Board BRD, DSN Files June 2016 840.3 KB
Schematics & Design Files Evaluation Board Schematic 2.0 May 2016 76 KB
Product Brochures Interface Brochure R02 November 2024 3.6 MB
Software: Drivers Linux 3.6.x and Newer 1G August 2024 29.7 KB
Software: Drivers Windows 10 and newer 2.7.0.0 January 2023 169.2 KB
Software: Drivers Windows 11 1.1.0.2 January 2023 42.5 KB
Software: Drivers Windows 7, 8 2.6.0.0 December 2019 145.7 KB
Software: Drivers Windows 10 1.1.0.1 June 2018 78 KB
Software: Drivers Windows XP, Vista, 7 1.1.0.0 December 2017 86 KB
Software: Drivers XRUSB1 for Win XP SP3 and newer 2.2.5.0 March 2016 1 MB
Software: Drivers Linux 2.6.18 to 3.4.x 1A January 2015 19.1 KB
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Quality & RoHS

Part Number RoHS | Exempt RoHS Halogen Free REACH TSCA MSL Rating / Peak Reflow Package
XR22802IL56-F N Y Y Y Y L3 / 260ᵒC QFN56 8x8 OPT1

Click on the links above to download the Certificate of Non-Use of Hazardous Substances.

Additional Quality Documentation may be available, please Contact Support.

Parts & Purchasing

Part Number Pkg Code Min Temp Max Temp Status Suggested Replacement Buy Now Order Samples PDN
XR22802IL56-F QFN56 8x8 OPT1 -40 85 Active Order
XR22802IL56TR-F QFN56 8x8 OPT1 -40 85 OBS XR22802IL56-F
XR22802IL56-0A-EB Board Active
Show obsolete parts
Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.

Packaging

Pkg Code Details Quantities Dimensions
QFN56 8x8 OPT1
  • JEDEC Reference: MO-220
  • MSL Pb-Free: L3 @ 260°C
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 29ºC/W
  • Bulk Pack Style: Tray
  • Quantity per Bulk Pack: 260
  • Quantity per Reel: 3000
  • Quantity per Tube: n/a
  • Quantity per Tray: 260
  • Reel Size (Dia. x Width x Pitch): 330 x 16 x 12
  • Tape & Reel Unit Orientation: Quadrant 1
  • Dimensions: mm
  • Length: 8.00
  • Width: 8.00
  • Thickness: 1.00
  • Lead Pitch: 0.50

Notifications

Distribution Date Description File
08/07/2024 MaxLinear has qualified Greatek, Taiwan, assembly site. In addition, the XR16M890IL32-F, XR20M1280IL24TR-F, XR21V1412IL32-F, and XR21V1412IL32TR-F have been qualified for Copper (Cu) wire bonding assembly. There is no change to product datasheet, form, fit or function.
07/17/2023 In 2023, MaxLinear will be converting all shipping labels for the parts noted from an EXAR format to MaxLinear’s label. During this transition customers may receive either label. This change affects only shipping and packing labels. This change will not affect the part number, part marking, manufacturing process or manufacturing sites. Only work in progress material will be converted. Existing inventory from MaxLinear’s warehouse, channel sales, distributor, and such, will not be converted. Hence, customers may experience receiving mixed shipments with both Exar and MaxLinear labels for some period until existing inventory of old labels is eventually cleared out. Situation is product to product with no predictable way to determine when all old labels will be exhausted. No change to product form, fit, function and reliability. ADDENDUM A: Fixed MBB label logo for DX204001 to MaxLinear logo. ADDENDUM B: Replaced ‘All other affected products outer box label’ with clearer pictures. Corrected Date Issued (from original PCN) issue date +90 days to August 30, 2023.
06/01/2023 In 2023, MaxLinear will be converting all shipping labels for the parts noted from an EXAR format to MaxLinear’s label. During this transition customers may receive either label. This change affects only shipping and packing labels. This change will not affect the part number, part marking, manufacturing process or manufacturing sites. Only work in progress material will be converted. Existing inventory from MaxLinear’s warehouse, channel sales, distributor, and such, will not be converted. Hence, customers may experience receiving mixed shipments with both Exar and MaxLinear labels for some period until existing inventory of old labels is eventually cleared out. Situation is product to product with no predictable way to determine when all old labels will be exhausted. No change to product form, fit, function and reliability.
06/01/2023 In 2023, MaxLinear will be converting all shipping labels for the parts noted from an EXAR format to MaxLinear’s label. During this transition customers may receive either label. This change affects only shipping and packing labels. This change will not affect the part number, part marking, manufacturing process or manufacturing sites. Only work in progress material will be converted. Existing inventory from MaxLinear’s warehouse, channel sales, distributor, and such, will not be converted. Hence, customers may experience receiving mixed shipments with both Exar and MaxLinear labels for some period until existing inventory of old labels is eventually cleared out. Situation is product to product with no predictable way to determine when all old labels will be exhausted. No change to product form, fit, function and reliability. ADDENDUM: Fixed MBB label logo for DX204001 to MaxLinear logo.
01/31/2022 To increase manufacturing capacity, MaxLinear has qualified UTL3 extension site as an alternate assembly site together with UTL1 for QFN and DFN products.
10/08/2021 In addition to the currently qualified UTAC, Thailand site, MaxLinear has qualified ANST, China, as an alternate site for assembly and test for the devices noted above. There is no change to datasheet, form, fit or function of the devices.
07/11/2017 Product Discontinuation Notification
01/31/2017 Addition of qualified 12 inch wafer processing line in Global Foundries, in addition to the currently qualified 8 inch wafer processing. Note: Reliability report will be available February 17, 2017.

FAQs & Support

Search our list of FAQs for answers to common technical questions.
For material content, environmental, quality and reliability questions review the Quality tab or visit our Quality page.
For ordering information and general customer service visit our Contact Us page.

Submit a Technical Support Question As a New Question

For some UARTs, Microsoft certified drivers are available for Windows Operating System and can be downloaded via Windows Update. These drivers and others, including for Linux and other Operating Systems can be found by visiting https://www.exar.com/design-tools/software-drivers Please note Software Driver Use Terms.

 

 
You can also get to this link by going to the exar.com website, clicking on Support (in black bar near top of page), then click on Design Tools, then under Evaluation Hardware and Software (towards right of page) click on Software Drivers.
 
 

Click on the version link under Driver Version of the desired type of UART, part number and operating system. A zip file is downloaded which contains a ReadMe file with instructions.

Links to datasheets and product family pages are in the software driver table for easy reference. 

Find the product page of the part that you want to get an evaluation board for and click on Parts & Purchasing. Example:

 

Find the icons under Buy Now or Order Samples:

 
 

Click on the Buy Now icon and see who has stock and click on the Buy button:

 
 
 

Alternatively, you can click on the Order Samples

 
 

If the icons are missing, then contact Customer Support.

ESD tests are “destructive tests.” The part is tested until it suffers damage. Therefore parts cannot be 100% tested in production, instead a sample of parts are characterized during the product qualification. The test procedure consists of “zapping” pins with a given voltage using the appropriate model and then running the part through electrical tests to check for functionality or performance degradation.

ESD is caused by static electricity. In order for an ESD event to occur there must be a buildup of static charge. Very high charge levels are actually quite rare. In a normal factory environment, taking basic ESD precautions (grounding-straps, anti-static smocks, ionizers, humidity control, etc.) static levels can be kept below a few tens of volts. In an uncontrolled environment, like an office, static levels rarely get above 2000 volts. Under some worstcase conditions (wearing synthetic fabrics, rubbing against synthetic upholstered furniture, extremely low humidity)
levels can go as high as 12 to 15 thousand volts. Actually to get to 15000 volts or higher you would need to be in an uncomfortably dry environment (humidity below 10%) otherwise static charge will naturally dissipate through corona discharge. It would definitely be considered a “bad hair day.” Humans can generally feel a static shock only above 3000 volts. A discharge greater than 4000 volts can cause an audible “pop.” But repeated lower level discharges can be imperceptible and still may have a cumulative damaging effect on sensitive ICs. All ICs, even those with robust protection, can be damaged if they are hit hard enough or often enough.

Most ICs in a typical system are at greatest risk of ESD damage in the factory when the PCB is assembled and the system is being built. After the system is put together they are soldered onto the PCB and shielded within a metal or plastic system enclosure. Interface ICs are designed to attach to an external connector that could be exposed to ESD when a cable is plugged in or when a person or object touches the connector. These interface pins are most likely to see ESD exposure and therefore benefit from additional protection.

The -F suffix indicates ROHS / Green compliance:
https://www.exar.com/quality-assurance-and-reliability/lead-free-program

Visit the product page for the part you are interested in.  The part's status is listed in the Parts & Purchasing section.  You can also view Product Lifecycle and Obsolescence Information including PDNs (Product Discontinuation Notifications).
 
To visit a product page, type the part into the search window on the top of the MaxLinear website.
 
In this example, we searched for XRA1201.  Visit the product page by clicking the part number or visit the orderable parts list by clicking "Orderable Parts". 
 
 
 

 

  

The Parts & Purchasing section of the product page shows the Status of all orderable part numbers for that product.  Click Show obsolete parts, to see all EOL or OBS products.

 
 
 

 

USB peripheral devices may operate in bus or self-powered modes. In bus powered mode, the peripheral device is powered by the USB host 5V VBUS power either directly, or for example through a voltage regulator that might provide a regulated 3.3V to the device from the 5V VBUS input. In self-powered mode, power to the peripheral device comes from another source other than the USB host VBUS. For example, power might come from an AC to DC converter.

 

MaxLinear USB to serial / UART(s), USB hubs and USB to Ethernet devices all comply fully to USB standards and are fully USB compliance tested. One USB compliance test ensures that self-powered peripheral devices do not have “back voltage” when disconnected from the USB host, on either the USB data signals (USBD+ / USBD-) or the VBUS power itself.

 

All MaxLinear USB UARTs, hubs and USB to Ethernet devices are USB full speed or high-speed devices. As such, they have an internal pull-up on the USBD+ signal to “advertise” their speed rating. The VBUS_SENSE pin on these devices must be connected to VBUS from the host, or upstream device if that is not the host, such that the device “senses” the disconnection from the host or upstream device. The default power mode advertised to the USB host for all USB UARTs and USB to Ethernet devices is bus powered mode. Self-powered mode can be programmed in either the internal OTP memory or external EEPROM for self-powered mode. For MaxLinear hubs, an external pin controls the power mode advertised to the USB host, except the XR22417 which must always be operated in self-powered USB mode.

Connect the USB data pins directly to the host or upstream hub. Connections should be impedance controlled to 90 ohms differential with short traces and no stubs. Connecting any other components that are not high impedance (series or shunt resistance, capacitance or inductance) will corrupt the USB data signaling and can prevent communication between the host and device. ESD protection diodes may be used and some EMI filters may also have only a slight impact on impedance but should be demonstrated for compliance with USB 2.0 devices. See Application Notes AN202 (USB UART Board Design Recommendations and Considerations for USB Compliance), section 2.0 Design Considerations  for more. 

1. Native drivers: Native drivers may be found in all major OS such as Windows, Linux, and Max OSX. Typically these drivers will be automatically loaded. In some cases, these are basic drivers and may have limitations on advanced device functionality, however. USB HID, Hub and CDC-ACM drivers are examples of native drivers. The CDC-ACM driver be used with our CDC-ACM class USB UARTs, but has limited functionality.

 

2. MaxLinear custom drivers: MaxLinear custom drivers may be used to support additional functionality in MaxLinear devices. For example, the MaxLinear custom driver for USB UARTs overcomes the limitations of the native CDC-ACM driver. See https://www.exar.com/design-tools/software-drivers for a list of and access to the drivers that we currently have. In some cases, the MaxLinear driver can also be customized, or source code can be provided after executing a Software License Agreement.

Yes: Go to the product page (XR22804 example below), click on the documentation tab on left, click on “Sample USB UART GUI” under Software:

 

Both Linux and Mac OSX have a native CDC-ECM driver which is automatically loaded and used by the XR2280x Ethernet function. Because Windows does not have a native CDC-ECM driver, MaxLinear supplies a custom driver, which can be found at https://www.exar.com/design-tools/software-drivers. 

All of MaxLinear / Exar's USB UARTs are CDC class / CDC-ACM compliant, except for XR21B1421 which is an HID class device. This means they can use a native CDC driver. All major OS have native CDC drivers, except Windows prior to Windows 10.

None of the MaxLinear / Exar USB UARTs require their custom driver, however they will have certain limitations when not using it. The native CDC driver is not capable of accessing the internal memory map of any device. As a result, when using the native CDC driver, the device “defaults” to a particular configuration. The main implications of this default configuration are that hardware RTS/CTS flow control is enabled and that other settings / advance settings are not configurable. Some devices, for example the XR21B1411 which has an internal OTP memory, can be programmed to change this default configuration, but the configuration cannot be changed “on the fly”.

1.  Enter root privileges: sudo -i
2.  Enter admin password.
3.  Edit /etc/modules file.  Append xr_usb_serial_common to the end of the file.
4.  Build the Exar/MxL driver from the folder using "make", confirm that the xr_usb_serial_common.ko file is successfully created.
5.  Run command: uname -r
This will return the kernal version currently in use. 
6.  Copy the resulting xr_usb_serial_common.ko to /lib/modules/2.6.38.8-generic in the above path with the kernal version that was returned in step 5.
7.  Run depmod.
8.  Reboot. 
9.  Connect the Exar/MxL USB UART.  Using ls/dev/tty* confirm /dev/ttyUSBn ports (Exar driver loaded) for Exar/MxL USB UART.
10. Connect another CDC device (not Exar/MxL), and confirm both /dev/ttyUSBn and /dev/ACMn ports. 

The maximum allowed bus-powered suspend current is 2.5mA per device function. The device function may not be the same as the IC, as there may be multiple device functions per IC. See the individual datasheet for a list of device functions. For example, the XR22804 has 8 device functions: an embedded hub, the Ethernet MAC and Phy, 4 UARTs, I2C controller and EDGE controller. Therefore, the XR22804 maximum allowed bus-powered suspend current is 8 x 2.5mA or 20mA. However, power used by all supporting XR22804 external components that use power from the USB host VBUS power must be included in the suspend current.

It is recommended, especially when connecting a USB cable to the VBUS 5V source.  See Application Note AN202 (USB UART Board Design Recommendations and Considerations for USB Compliance), section 2.2.2 In-rush Current for more.

The OTP can be programmed to modify various USB configuration descriptors such as Vendor ID, Product ID, Device Attributes and maximum power consumption. See Application Note AN202 (USB UART board Design Considerations for USB Compliance), section 2.3 External EEPROM or on-chip OTP for more. The OTP can also be programmed to change default register values, which can be found in the individual datasheets.

For thermal and ESD benefits, the following PCB design is recommended to provide thermal and electrostatic paths:

 

1. Design the PCB to conduct heat away from the device using thermal vias under the QFN IC to the digital ground plane.

2. Mount the metal shells of the USB and Ethernet connectors to a separate Chassis / Earth ground.

3. Place the chassis / earth ground metal on one PCB layer, digital ground on another PCB layer and connect through a zero ohm resistor located away from sensitive electronic devices as much as possible.

4. Place a large metal trace for the Earth ground all the way surrounding the PCB, except under the Ethernet connector.

 

As an example, see the schematic and an example PCB layout for the XR22800 Evaluation Board below:

 
Schematic: 
  
 
Layer 1 Chassis / Earth ground layout with mounting pins for Ethernet and USB metal shells: 
 
 
 
Layer 2 Digital ground layout:
 
 
 
Stackup layout with zero ohm resistor connecting Earth and Digital ground: 
 
 
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