Overview
| Information | |
|---|---|
| Min Temp (°C) | -5 |
| Max Temp (°C) | 85 |
| Package | FC-FBGA 12x13 |
The MxL93642 and MxL93643 are highly integrated PAM4 DSP SoCs that enable 400Gbps optical interconnects using 100Gbps over a single optical wavelength (100G/λ).
The devices have a high-speed electrical interface with four transmit (Tx) and receive (Rx) input/output (I/O) that connect electrically through a module connector to the host ASIC.
The devices also have a high-speed optical side interface that has four Tx and Rx I/O that connect through the optical components to optical fibers.
The electrical interface supports 106.25Gbps PAM4 signaling per lane over C2M host channels.
The optical interface supports 106.25Gbps PAM4 signaling per wavelength for DR, FR, and LR applications.
The devices support DSP functions including line side Tx digital pre-distortion (DPD), transmit pre-emphasis (Tx FIR), and receive feed-forward equalization (Rx FFE).
The MxL9364x, in a 12mm × 13mm package, includes integrated TOSA drivers with differential and single-ended options for both silicon photonics (SiPh) and electro-absorption modulated laser (EML) implementations. It offers exceptional signal integrity for signals in a compact footprint suitable for next generation optical module form-factors.
- 400G retimer capacity that enables 400G DR4, FR4, LR4, VR4/SR4
- 400G to 100G break-out mode
- Full 4 x 4 crossbar functionality
- Tx equalization includes pre-emphasis, digital pre-distortion, and reflection cancellation
- Rx equalization includes CTLE, multi-tap FFE and reflection cancellation
- Supports host channels with Nyquist loss in excess of 20dB
- Integrated crystal oscillator eliminates the need for a costly reference clock source
- Small package size to enable the QSFP112 space requirements
- Mission mode BER monitoring
- SNR/Histogram reporting for each receiver on both electrical and optical interfaces
- Diagnostic loop-back, test pattern generation, and error checking
- SPI and I2C slave interface to communicate to module MCU
- SPI master for flash memory interface
- I2C master interface for TIA direct control
- Embedded CPU for real-time control
- Squelch function when Loss-of-Signal (LOS) or Loss-of-Lock (LOL) is detected
- QSFP112 optical modules
- QSFP112 AEC/ACC and AOC
Documentation & Design Tools
| Type | Title | Version | Date | File Size |
|---|---|---|---|---|
| Product Flyers | High-Speed Interconnect Products | R01 | March 2023 | 990.5 KB |
Parts & Purchasing
| Part Number | Min Temp | Max Temp | Status |
|---|---|---|---|
| MxL93643-PV-T | -5 | 85 | Active |
Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.
